US 8,747,070 6/10/2014 SPINNING HORIZONTAL AXIS TURBINE Blonder Greg E
- A wind turbine whose blades follow a figure 8 pattern as they rotate around the drive axle. This arrangement is more resistant to turbulence than a typical three-blade, horizontal lift design, and more efficient and capital efficient than a simple drag blade arrangement. High efficiency lift-blade designs are only suited for sites with consistent wind profiles. This invention is more efficient in a wider range of sites. More details at Spinorwind.
US 7,964,883 6/21/2011 LIGHT EMITTING DIODE PACKAGE ASSEMBLY THAT EMULATES THE LIGHT PATTERN PRODUCED BY AND INCANDESCENT BULB Mazzochette, Amaya, Lin, Blonder
- A design for an LED lightbulb where the LEDs are mounted on a thermally conductive substrate, and the LEDs are arranged to produce a spherically uniform output. In some cases the LEDs are mounted on opposite side of one or two board, and some LEDs are located in a refelctor ring.
5,574,258 11/12/96 HEAT-SHRINK CRIMPING DEVICE AND METHOD G.Blonder
shrink tubing with an internal wire mesh, so the tubing creates an
insulated, electrical splice in one step.
01/17/95 SOLDER PASTE MIXTURE Blonder Greg E; Degani Yinon; Dudderar
- A solder
paste for the assembly of electronic devices to printed circuit boards,
which eliminates an industry-wide problem of solder ball formation.
Solder balls often lead to electrical failure and other quality concerns.
10/12/93 METHOD FOR FORMING A SLOPED SURFACE HAVING A PREDETERMINED
SLOPE Blonder Greg E
lithographic technique to contollably slope a thin film. Useful for
optical waveguides, 2-D lenses, I.C. wiring,...
09/22/92 FINE LINE SCRIBING OF CONDUCTIVE MATERIAL; DETERMINING LINEWIDTH
BY ELECTRIC FIELD Blonder Greg E; Fulton Theodore A
- By dragging
a fine tip across a metal film while applying a voltage, a narrow
groove of material is removed. Suited for making photomasks, decorative
products, metal screens,..
07/30/91 VARIABLE GAP DEVICE AND METHOD OF MANUFACTURE Blonder Greg
E; Lamola Angelo A; Lieberman Robert A, and
06/26/90 SEMICONDUCTOR INTEGRATED CIRCUIT CHIP-TO-CHIP INTERCONNECTION
SCHEME Blonder Greg E; Fulton Theodore A
of using wirebonds or solder to attach bare silicon I.C.s to a substrate,
we employ small gold pads and textured mating surfaces to cold weld
the two parts together. Advantages include low inductance, room temperature
assembly, no chemical fluxes and high strength.
10/14/86 VARIABLE GAP DEVICE AND METHOD OF MANUFACTURE Blonder Greg
E; Lamola Angelo A; Lieberman Robert A
- A thin
film optical cavity is formed such that electricity or pressure can
deform the cavity and change its color via optical interference. Suitable
for blood pressure sensors, displays, electrostatic relays,..